贵阳华翔半导体有限公司 main business: and other products. Company respected "practical, hard work, responsibility" spirit of enterprise, and to integrity, win-win, creating business ideas, to create a good business environment, with a new management model, perfect technology, attentive service, excellent quality of basic survival, we always adhere to customer first intentions to serve customers, persist in using their services to impress clients.
welcome new and old customers to visit our company guidance, my company specific address is: 贵州 贵阳市 贵阳高科技开发区.
If you are interested in our products or have any questions, you can give us a message, or contact us directly, we will receive your information, will be the first time in a timely manner contact with you.
| 序号 | 公布号 | 发明名称 | 公布日期 | 摘要 |
| 1 | CN101232781A | 陶瓷基板上绘制电子组件线路图的技术改良 | 2008.07.30 | 本发明公开一种陶瓷基板上绘制电子组件线路图的技术改良，系对陶瓷基板上加入电阻、电容、二极管、集成电路 |
| 2 | CN101231980A | 不需打线之电子器件 | 2008.07.30 | 本发明系有关一种不需打线之电子器件，其系主要利用一不透光之线路基片或晶粒，以其电极表面直接与印刷线路 |
| 3 | CN101231981A | 半导体晶粒封装用引线框架之结构改良 | 2008.07.30 | 本创作系针对一般半导体晶粒封装用引线框架之散热性较差而加以突破改良，其系在该引线框架结构上，将压焊引 |
| 4 | CN101232006A | 多晶粒模块器件 | 2008.07.30 | 本发明系提供一多晶粒模块器件，其系对多个单元在绝缘基片上电联接的器件，其主要结构系为：在该多晶粒模块 |
| 5 | CN101232005A | MCM(多晶粒模块)之交直流转换器 | 2008.07.30 | 提供一多晶粒模块器件，其系对多个单元在绝缘基片上电联接的器件，其主要结构系为；在该多晶粒模块中，该单 |
| 6 | CN101231960A | 半导体器件封装技术之改良 | 2008.07.30 | 一种半导体器件封装技术之改良，本创作系针对半导体器件封装用装置过程中，经过划片及裂片后的管蕊，需要依 |
Map(The red dot in the figure below is 贵阳华翔半导体有限公司 at the specific location, the map can drag, double zoom)
